| Customization: | Available |
|---|---|
| Type: | Android Mobile Phone Motherboard 4G |
| Dielectric: | CEM-4 |
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Single Sided
Plated Through Hole
Multi-Layer (Up to 40 Layers) including buried and blind Via's
Multi-Layer with bonded heat sinks
Flexible PCB
Flex-Rigid PCB
High Temperature (Polyimide)
Microwave (PTFE)
Copper Invar Construction
Special Gold for 'Chip on Board'
Controlled Impedance
Aluminium Clad Technologies
Fast/Quick Turn PCB Prototyping
Good quality
DFM simulation
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