Intel® Elkhart Lake Series Soc, Power Consumption: 4.5-12W

Product Details
Customization: Available
Type: Industrial Grade
Dielectric: CEM-4
Gold Member Since 2023

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Basic Info.

Model NO.
PCM-E352
Application
Industrial Grade
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Infinites
Usage
Rearview Mirror
Usage1
Aerospace PCB
Usage2
Large Server PCB
Usage3
Industrial Grade PCB
Usage4
Industrial Grade PCB
Transport Package
Sealed in Tinfoil
Specification
As Requested
Trademark
Infinites or OEM
Origin
China
HS Code
8479909090
Production Capacity
500000PCS/Year

Product Description

Intel® Elkhart Lake Series SOC, power consumption: 4.5-12W
For PCB model customization, the user must upload a compressed package of PCB file (Gerber file is the best type) at the end of the customization For new model customization, the user must upload a compressed package of PCB file (Gerber file is the best type) at the end of the customization page, if there are other board instructions (including but not limited to: PDF, WORD, EXCEL, TXT, JPG, BMP), please also enter the compressed package, so that we can match your board 100%.
Intel® Elkhart Lake Series SOC, power consumption: 4.5-12W
» Intel® Elkhart Lake Series SOC, power consumption: 4.5-12W

» SO-DIMM DDR4 memory (voltage 1.2V, up to 16G support) Maximum frequency 3200MHz

» Intel 11th generation display core, support DX12, MPEG2, H.264, JPEG/MJPEG, H.265 (HEVC)

» Support eDP 1.3, HDMI 1.4A, LVDS (18/24 bit single channel or dual channel)

» Support 3 10/100/1000Mbit Ethernet, SATA, MSATA

» USB 2.0 and USB 3.0 interface, RS232/422/485 serial port, GPIO interface

» The BIOS supports mouse operation

» Voltage: +9V~+24V, +12V is recommended
Intel® Elkhart Lake Series Soc, Power Consumption: 4.5-12W
Intel® Elkhart Lake Series Soc, Power Consumption: 4.5-12W

who we are

 Single Sided

 Plated Through Hole

 Multi-Layer (Up to 40 Layers) including buried and blind Via's

 Multi-Layer with bonded heat sinks

 Flexible PCB

 Flex-Rigid PCB

our advantage

 High Temperature (Polyimide)

 Microwave (PTFE)

 Copper Invar Construction

 Special Gold for 'Chip on Board'

 Controlled Impedance

 Aluminium Clad Technologies

why choose us

 Fast/Quick Turn PCB Prototyping

 Good quality

 DFM simulation
 

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