6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample

Product Details
Customization: Available
Type: Combining Rigid Circuit Board
Dielectric: CEM-4
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  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
  • 6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
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Basic Info.

Model NO.
415
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Automotive Connector
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Infinites
Usage
5g Communication PCB
Usage1
Aerospace PCB
Usage2
Large Server PCB
Usage3
Intelligent Medical PCB
Usage4
Industrial Internet PCB
Transport Package
Sealed in Tinfoil
Specification
As Requested
Trademark
Infinites or OEM
Origin
China
HS Code
8479909090
Production Capacity
500000PCS/Year

Packaging & Delivery

Package Size
23.00cm * 33.00cm * 1.00cm
Package Gross Weight
12.000kg

Product Description

6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
For PCB model customization, the user must upload a compressed package of PCB file (Gerber file is the best type) at the end of the customization For new model customization, the user must upload a compressed package of PCB file (Gerber file is the best type) at the end of the customization page, if there are other board instructions (including but not limited to: PDF, WORD, EXCEL, TXT, JPG, BMP), please also enter the compressed package, so that we can match your board 100%.


Data Engineering & Tooling Services
Preparation of your data is a key element of our process to ensure the success of all subsequent NPI and production operations. Our experienced data engineering department play a crucial role in managing all the elements: From tooling the blank PCB substrate to creating controlled digital data sets and drawings essential for the production process.  Altium PCB Design Tools allow you to seamlessly integrate with our production procedures, eliminating the risk of technical misunderstanding and delays.

"The level of detail and advice given to us during the initial PCB layout phase of our project went far beyond our expectations, ultimately leading to another successful, time-critical project for us. 

Engineering, Tooling & PCB Layout

A comprehensive suite of engineering services, from data engineering and precise tooling to customised PCB design layouts, ensuring smooth transition from conception to production.

6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
 
6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample

Full Validation and Compliance

Blank PCB Engineering 'Front End Tooling'

  • Engineering Validation of PCB Layout: Identification of potential issues and supporting of best practices.
  • Ucamco Tool Utilisation: DFM, DRC, and netlist connectivity checks for issues such as solder mask concerns, via tenting, layer stack conflicts, and impedance calculations.
  • Direct Data Supply to PCB Fabricator: Verified digital data is supplied directly to the PCB fabricator, ensuring full compliance and risk management.
  • Considered Areas: Board transport, SMT fiducial placement marks, board panel routing, IPC, and UL compliance.
  • Compliance Assurance: All your blank PCBs will adhere to IPC standards and meet subsequent build process requirements.

Seamless Production with Enhanced Precision & Efficiency

Data Engineering Services

  • Data Engineering: Advanced identification of potential risks and issues.
  • Aegis Factory Logix Tools: Creating full digital data sets directly from your ODB++ for precision manufacturing.
  • Full Workflow: Verified placement and orientation of all components directly from your core data and netlist.
  • Digital Data: All data sets and process parameters are configured and issue controlled, from solder paste typology, SMT placement, AOI inspection to defining items for X-Ray to provide concise, controlled and repeatable process control.
  • Detailed Instructions: All sub-operations are controlled by bespoke digital drawings and work instructions, from intricate details, forming, cable assemblies to final box build assembly and packaging. Nothing is left to chance.
6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample
 
6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample

On-Demand Custom PCB Layout Support

PCB Layout with Altium Design Tools

  • Extensive on-site technical design engineering expertise in Altium design tools for custom PCB layouts including high-density DDR3 layouts.
  • Full understanding of unique requirements for blank PCB manufacturing and assembly ensuring a smooth transition from prototype, NPI to production without delays, oversights, or technical limitations.
  • Optimisation of layout practices for efficient bare PCB production, covering RF to high-speed digital boards.
  • Close collaboration with you to ensure your design requirements are fully understood and implemented.
  • Signal Integrity (SI) verification to maintain clear, robust signals, minimising distortion, noise, and issues like crosstalk or signal degradation.
  • Mechanical Constraints assessment includes creation of 3D models to check component fit, clearances, and alignment within the 3D space of the PCB.
  • Complete data pack for production engineering including Gerber data, drill drawings, assembly drawings, and ODB++ for tooling accuracy.

Key Benefits of Altium PCB Layout

  • Manually routed PCBs
  •  
  • Schematic capture to layout
  •  
  • PCB technologies include rigid and flex-rigid printed circuit boards
  •  
  • Design types include analogue, RF and high-speed digital circuits
  •  
  • Impedance controlled & layer stack up considerations
  •  
  • DDR 3, incorporating virtual via and net constraints
  •  
  • Differential/balanced pairs & bus routing
  • Signal integrity analysis (SI) & 3D models
  • DFA, Design for assembly/manufacture supported by on-site services
6th Order Arbitrary Interconnection HDI Buried & Blind Via PCB Borad Sample

 

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