Customization: | Available |
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Metal Coating: | Gold |
Mode of Production: | SMT+DIP |
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Model NO. | EEG-PCBA185 | Condition | New |
Certificate | ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS |
PCB Material
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Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free |
PCB Shape | Rectangular, Round, Slots, Cutouts, Complex | Solder Mask | Green/Black/White/Red/Blue/Yellow/Purple..etc |
Board Thickness | 0.2mm-8mm | Copper Thickness | 18um-3500um(0.5- 100oz) |
Service | PCB/Componentssourcing/Assembly/Test/Package | PCBA QA | Full Test Include Aoi, in-Circuit Test (Ict) |
Layer | 1-36 Layers | Max. PCB Size | 1900mm*600mm |
Profiling Punching | Routing, V-Cut, Beveling | Surface Finishing | HASL/HASL Lead Free, Chemical Tin, Chemical Gold |
PCB Type | Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible | Test | X-ray, Aoi, in-Circuit Test (Ict), Functional Test |
PCBA Packaging | ESD Packaging, Shockproof Packaging, Anti-Drop | Transport Package | ESD Bag+Bubble Wrapped +Carton |
Specification | Customized PCBA | Trademark | EEG |
Origin | Made in China | ||
Production Capacity | 50000/Month |
1 to 36 layers rigid pcb and 2 to 14 layers flexible and rigid flexible pcb |
Blind/buried holes with sequential lamination |
HDI builds microthrough-hole technology with solid copper filling through holes |
· On-off and non-on-off filling in gasket technology |
Heavy copper weighs up to 12 ounces. Plate thickness up to 6.5mm. Board size up to 1010X610mm. |
Special materials and mixed structures |
Specification
Term | Detailed Specification of PCBA Board Manufacturing |
Layer | 1-36 layer |
Material | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum,Rogers,Taconic,Isola..etc |
Board thickness | 0.4mm-4mm |
Max.finished board side | 1900*600mm |
Min.drilled hole size | 0.1mm |
Min.line width | 2.95mil |
Min.line spacing | 2.95mil |
Surface finish/treatment | HASL/HASL lead free,Chemical tin/Gold,Immersion gold/Silver,OSP,Gold Plating,Gold finger. |
Copper thickness | 0.5-100oz |
Solder mask color | green/black/white/red/blue/yellow/purple |
Inner packing | Vacuum packing,Plastic bag |
Outer packing | Standard carton packing |
Hole tolerance | PTH:±0.075,NTPH:±0.05 |
Certificate | UL,ISO9001,ISO14001,ROHS,CQC,TS16949 |
Profiling Punching | Routing,V-CUT, Beveling |
Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
Various sizes like 1206,0805,0603 components SMT technology | |
ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
PCBA Assembly With CE,FCC,Rohs Approval | |
Nitrogen gas reflow soldering technology for SMT | |
High Standard SMT&Solder Assembly Line | |
High density interconnected board placement technology capacity | |
Quote&Production Requirement | Gerber File or PCBA File for Bare PCBA Board Fabrication |
Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly |
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To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. |
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Testing Guide & Function Testing method to ensure the quality to reach nearly 0% scrap rate |
PCB Assembly OEM Service |
Electronic Components Material Purchasing |
Bare PCB Fabrication |
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service |
PCB Assembly Service: SMT, BGA, DIP |
PCBA test: AOI, In-Circuit Test (ICT), Functional Test (FCT) |
Conformal Coating Service |
Prototyping and Mass Production |
PCBA ODM service |
PCB Layout, PCBA Design According To Your Idea |
PCBA Copy/Clone |
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design |
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming |
Embedded User Interface Design / lSystem Hardware Design |
Product Parameters
* Gerber files of the bare PCB |
* Bill of materials include: Manufacturer's part number, type of part, type of packaging,component locations listed by reference designators and quantity |
* Dimensional specifications for non-standard components |
* Assembly drawing, including any change notice |
* Pick and Place file |
* Final test procedures (if customer need us test) |